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Injection Molding |
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Injection
Molding Simulation and Material Characterization |
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1992-1996
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141. |
"Generalized Planar Sweeping of Polygons," K. Sambandan, K. Kedem
and K. K. Wang, Journal of Manufacturing Systems, 11, 246-257 (1992).
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142. |
"Rheological Characterization of Fast-Reacting Themosets Through
Spiral Flow Experiments," U.F. Gonzalez, S. F. Shen and C. Cohen,
Polymer Engineering and Science, 32, 172-181 (1992).
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143. |
"Shear-Rate-Dependence Modeling of Polymer Melt Viscosity," C.
A. Hieber and H. H. Chiang, Polymer Engineering and Science, 32,
931-938 (1992).
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144. |
"Numerical Simulation of the Coinjection Molding Process," L. S.
Turng, V. W. Wang and K. K. Wang, Journal of Engineering Materials
and Technology, 115, 48-53 (1993).
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145. |
"Comparison of Flat Thin-Shell Finite Elements for Structural Analysis
of Injection-Molded Parts," L. Kudryavtsev and K. K. Wang, SPE ANTEC
Technical Papers, 39, 88-90 (1993).
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146. |
"An Integrated Design Program for Injection Molding Process,"
W. R. Jong, K. Himasekhar, H. H. Chiang and K. K. Wang, SPE ANTEC
Technical Papers, 39, 91-97 (1993).
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147. |
"Spiral-Flow Analysis Including Variable-Density Effects," C.
A. Hieber and H. H. Chiang, SPE ANTEC Technical Papers, 39, 102-107
(1993).
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148. |
"Analysis of Wire Sweep Related to Encapsulation of Semiconductor
Chips," S. Han and K. K. Wang, SPE ANTEC Technical Papers, 39, 153-157
(1993).
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149. |
"An Analytical and Experimental Study of Warpage and Shrinkage
of an Injection Molded Part," S. J. Ni and K. K. Wang, SPE ANTEC
Technical Papers, 39, 1612-1617 (1993).
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150. |
"Effect of Processing Conditions on Fiber Orientation in Injection-Molded
Composites," M. Gupta and K. K. Wang, SPE ANTEC Technical Papers,
39, 2290-2296 (1993).
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151. |
"Hydrodynamic, Translational Diffusion in Fiber Suspensions Subject
to Simple Shear Flow," M. Rahnama, D. L. Koch, Y. Iso and C. Cohen,
Phys. Fluids A, 5, 849-862 (1993).
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152. |
"Promising Manufacturing Processes for the 21st Century," K. K.
Wang (keynote speaker), Proceedings of the 2nd International Conference
on Computer Integrated Manufacturing September 6-10, 1993 in Singapore,
(eds., A. Sen, J. Winsor and R. Gay, GINTIC Institute of Manufacturing
Technology), 1, xiv-ix (1993).
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153. |
"Fiber Orientation and Mechanical Properties of Short-Fiber-Reinforced
Injection-Molded Composites: Simulated and Experimental Results,"
M. Gupta and K. K. Wang, Polymer Composites, 14, October, 367-382
(1993).
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154. |
"Entrance Effects for Power-Law Fluid," M. Gupta, C. A. Hieber
and K. K. Wang, Polymer Engineering and Science, 34, 3 (1994).
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155. |
"Viscosity Characterization of Fast-Curing Epoxy Molding Compound
using a Modified Slit Rheometer", presented at SPE ANTEC, May 1-5
(1994).
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156. |
"An Integrated Design System for 3-D Runner Balancing of Injection-Molding
Process," W.R.Jong, S.C.Chen and K.K.Wang, SPE ANTEC Technical Papers,
40, 749-754(1994)
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157. |
"Experimental Investigation of Thermal Contact Resistance in Injection
Molding," B.O.Rhee, C.A. Hieber and K.K.Wang, SPE ANTEC Technical
Papers, 40,496-500(1994).
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158. |
"Twenty Years of CIMP Research Towards CAE for Injection Molding",
presented at the 1994 International Mechanical Engineering Congress
and Exposition, Chicago, IL, November 6-11, appeared in Advances
in Computer- Aided Engineering (CAE) of Polymer Processing, MD-Vol.
49/HTD-Vol. 283, ASME, November 1994, pp. 1-5.
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159. |
"Buckling of a Center-Gated, Injection-Molded Disk under Residual
Membrane Forces", (with W-Y. Shih), presented at the 1994 International
Mechanical Engineering Congress and Exposition, Chicago, IL, November
6-11, appeared in Advances in Computer-Aided Engineering (CAE) of
Polymer Processing, MD- Vol. 49/HTD-Vol. 283, ASME, November 1994,
pp. 163-173.
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160. |
"Reduction of Wire Sweep During Chip Encapsulation
by Runner Balancing and Ram Control", S.Han and K.K.Wang, presented
at the 1994 International Mechanical Engineering Congress and Exposition,
Chicago, IL, November 6-11, appeared in Advances in Computer-Aided
Engineering (CAE) of Polymer Processing, MD-Vol. 49/HTD-Vol. 283,
ASME,175-190, November (1994). |
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