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Injection Molding Simulation and Material Characterization
 
1995-1996
161.

161. "Elastic Buckling of a Circular Disk Due to Internal Memberane Forces," W.-Y.Shih, L. Kudryavtsev and K.K. Wang, The Journal of Applied Mechanics, 62, 813-816 September(1995).

162.

162. "Effects of Fillers On Wire Sweep in Semiconductor Chip Encapsulation," S.Han and K.K. Wang, IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, 18,4, 744-750, November(1995).

163.

163. "Correlations for the Quiescent Crystalization Kinetics of Isotactic Polypropylene and Poly(ethyleneterephthalate),"C.A. Hieber, Polymer,36,7,1455-1467(1995).

164.

"The Effect of Hydrodynamic Interactions on the Orientation Distribution in a Fiber Suspension Subject to Simple Shear Flow," M.Rahnama, D.L.Koch and E.S.G. Shaqfeh, Phys. Fluids 7,3, 487-506,March(1995).

165.

"An Approximate Prediction of Entrance Loss for Power-Law and Viscoelastic Fluids," M. Gupta, C.A. Hieber and K.K. Wang, SPE ANTEC Technical Papers,41, 774-778(1995).

166.

"Optimum Design of Process Conditions to Minimize Residual Stress in Injection Molded Parts," S.Kang, C.A. Hieber and K.K. Wang, SPE ANTEC Technical Papers 41, 991-996(1995).

167.

"A Knowledge-Based Synthesis System for Chip Encapsulation,"Y.J.Huh, S.Han and K.K. Wang, SPE ANTEC Technical Papers, 41, 1377-1381(1995).

168.

"Rheo-Kinetic Measurements for the Determination of Stress-Induced Crystallinity in Polyethylene Terephthalate," K.A.Narh,E.Roa,M.D.Saindon,C.Cohen and K.K.Wang SPE ANTEC Technical Papers, 41,2932-2936(1995).

169.

"Observations of Fiber Orientation in Suspensions Subjected to Planar Extensional Flows," M. Rahnama, D.L.Koch and C.Cohen, Phys. Fluids 7,8,1811-1817(1995).

170.

"Simulation of Materials Processing: Theory, Methods and Applications," N.Santhanam & K.Himasekhar and K.K. Wang, Proceedings of the Fifth International Conference on Numerical Methods in Industrial Forming Processes-NUMIFORM '95,Ithaca, NY, 1059-1063, June 18-21(1995).

171.

"A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments," S. Han and K.K. Wang, Transactions of the ASME, 117,178-184,Sept.(1995).

172.

"Planning for the Manufacture of Axisymmetric Parts: An AL-Based Approach,"S. S. Jagdale and K.K. Wang, Computers Ind. Engng. 28, 4, 917-925(1995).

173.

"Orientation in Simple Shear Flow of Semi-Dilute Fiber Suspensions 1. Weakly elastic fluids," Y. Iso, D.Koch and C. Cohen, J. Non-Newtonian Fluid Mechanics, 62, 115-134(1996).

174.

"Experimental and Analytical Study on the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips." S. Han, S-Y. Cho and K.K. Wang, Proceedings of the 46th Electronic Components & Technology Conference, Orlando, FL,327-334, May 28-31(1996).

 
 
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