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Injection Molding |
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Injection
Molding Simulation and Material Characterization |
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1995-1996
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161. |
161. "Elastic Buckling of a Circular Disk Due to Internal Memberane Forces,"
W.-Y.Shih, L. Kudryavtsev and K.K. Wang, The Journal of Applied Mechanics, 62,
813-816 September(1995).
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162. |
162. "Effects of Fillers On Wire Sweep in Semiconductor Chip Encapsulation,"
S.Han and K.K. Wang, IEEE Transactions on Components, Packaging
and Manufacturing Technology-Part B, 18,4, 744-750, November(1995).
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163. |
163. "Correlations for the Quiescent Crystalization Kinetics of
Isotactic Polypropylene and Poly(ethyleneterephthalate),"C.A. Hieber,
Polymer,36,7,1455-1467(1995).
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164. |
"The Effect of Hydrodynamic Interactions on the Orientation Distribution
in a Fiber Suspension Subject to Simple Shear Flow," M.Rahnama,
D.L.Koch and E.S.G. Shaqfeh, Phys. Fluids 7,3, 487-506,March(1995).
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165. |
"An Approximate Prediction of Entrance Loss for Power-Law and Viscoelastic
Fluids," M. Gupta, C.A. Hieber and K.K. Wang, SPE ANTEC Technical
Papers,41, 774-778(1995).
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166. |
"Optimum Design of Process Conditions to Minimize Residual Stress
in Injection Molded Parts," S.Kang, C.A. Hieber and K.K. Wang, SPE
ANTEC Technical Papers 41, 991-996(1995).
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167. |
"A Knowledge-Based Synthesis System for Chip Encapsulation,"Y.J.Huh,
S.Han and K.K. Wang, SPE ANTEC Technical Papers, 41, 1377-1381(1995).
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168. |
"Rheo-Kinetic Measurements for the Determination of Stress-Induced
Crystallinity in Polyethylene Terephthalate," K.A.Narh,E.Roa,M.D.Saindon,C.Cohen
and K.K.Wang SPE ANTEC Technical Papers, 41,2932-2936(1995).
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169. |
"Observations of Fiber Orientation in Suspensions Subjected to
Planar Extensional Flows," M. Rahnama, D.L.Koch and C.Cohen, Phys.
Fluids 7,8,1811-1817(1995).
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170. |
"Simulation of Materials Processing: Theory, Methods and Applications,"
N.Santhanam & K.Himasekhar and K.K. Wang, Proceedings of the Fifth
International Conference on Numerical Methods in Industrial Forming
Processes-NUMIFORM '95,Ithaca, NY, 1059-1063, June 18-21(1995).
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171. |
"A Study on Wire Sweep in Encapsulation of Semiconductor Chips
Using Simulated Experiments," S. Han and K.K. Wang, Transactions
of the ASME, 117,178-184,Sept.(1995).
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172. |
"Planning for the Manufacture of Axisymmetric Parts: An AL-Based
Approach,"S. S. Jagdale and K.K. Wang, Computers Ind. Engng. 28,
4, 917-925(1995).
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173. |
"Orientation in Simple Shear Flow of Semi-Dilute Fiber Suspensions
1. Weakly elastic fluids," Y. Iso, D.Koch and C. Cohen, J. Non-Newtonian
Fluid Mechanics, 62, 115-134(1996).
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174. |
"Experimental and Analytical Study on the Flow of Encapsulant
During Underfill Encapsulation of Flip-Chips." S. Han, S-Y. Cho
and K.K. Wang, Proceedings of the 46th Electronic Components & Technology
Conference, Orlando, FL,327-334, May 28-31(1996).
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